 Nā Huahana> Ceramic substrate> Ua hūnāʻo Cerramic Substrate> ʻO Laser cutting 1mm 96% alumina cemic wafer

ʻO Laser cutting 1mm 96% alumina cemic wafer

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option	Alumina Ceramic wafer AlN, ZrO2, Si3N4 ceramic available Standard and customized specification Offer post-processing service Min. thickness to be 0.11mm
Hoʻokaʻaʻike

ʻO keʻano o ka uku: T/T,Paypal
ʻO Incoterm: FOB,CFR,CIF,FCA,CPT,CIP,DDU,EXW
Min. Kāpena: 500 Piece/Pieces
Nā kaʻa: Land,Air,Express
ʻO Port: Shenzhen Port,Hongkong Port

Ka hiki ke hoʻolako a me nā ʻike hou aku

Additional Information

Packaging: Hōʻike Export Carton

'Ohanahana: 100,000 pcs/month

Nā kaʻa: Land,Air,Express

Kahi o ka hoʻomaka: Hunan, Kina

Ka hoʻolakoʻana i ka pono: 500,000pcs/month

Palapala: RoHS,REACH

HS Code: 8547100000

ʻO Port: Shenzhen Port,Hongkong Port

ʻO keʻano o ka uku: T/T,Paypal

ʻO Incoterm: FOB,CFR,CIF,FCA,CPT,CIP,DDU,EXW

Huahana Huahana

Hoʻohālike No.: As per customer's specification

ʻO Brand: Jinghii cheimtic

Place Of Origin: China

Types Of: Dielectric Ceramics, Insulating Ceramics

Material: Alumina, Zirconia

Features: Excellent Insulation, Heat Dissipation

Certificate: ISO9001:2015, RoHS, REACH

Tolerance: Thickness To Be 0.02mm After Lapping

Color: White, Pink, Balck, Ivory Optional

Purity Option: 94.4% 95%, 99% Or 99.5% Alumina

Precision Process: Lapping,Laser Scribing and Cutting

Application: For Power Electronic Modules

Hāʻawe & lawe

Nā Uniona Kuai:	Piece/Pieces
ʻAno pūʻolo:	Hōʻike Export Carton
Laʻana kiʻi:
Hoʻoili:

Hōʻike Huahana

ʻO Laser cutting 1mm 96% alumina cemic wafer ʻO ka wehewehe Ua hanaʻia ka waterer ceremic ma waho o 96% aluminim oxide, akā 99%, 99%, 99%, 99%,ʻo 99.6%,ʻo ke koiʻana o ka noi noi. ʻO ke kaʻina hana maʻamau ke kau nei i ke kauʻana i ka mānoanoa o ka mānoanoa o ka subsemic substrate liʻiliʻi ma kahi o 1.2mm. He mea maʻalahi ke hoʻokō i nāʻano likeʻole,ʻanoʻokoʻa me ka pololei kiʻekiʻe o dimener, Traser Chubing. Ma kaʻaoʻao'ē aʻe, e hoʻomaloʻo ke kaʻina hana i...

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Category: Ua hūnāʻo Cerramic Substrate

 Nā Huahana> Ceramic substrate> Ua hūnāʻo Cerramic Substrate> ʻO Laser cutting 1mm 96% alumina cemic wafer